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    High Frequency FCCL and Base Materials;

    Introduction

    First High Speed & High Frequency single-side & double-side FCCL, manufactured by using self-developed MPI with low Dk / low Df properties, or using LCP resin / film, possess low Dk and low Df, and can be used in high speed & high frequency FPC/PCB for decreasing transmission loss. We also manufacture High Speed & High Frequency Cover Layer, for the convenience of customers’ material selection.

    Basic Property

    Test Item

    IPC TM-650

    ( or other )

    Uni

    FSC-1003EKT

    FSC-1003EF

    FSC-1503EF

    FSC-3003EAD

    FDC-3003EAD

     Peel Strength

    Method 2.4.9 B

    N/cm

    11.3

    11

    12

    10

    11

     Dimensional Stability

    Method 2.2.4 B

    %

    -0.04

    -0.03

    -0.03

    0.05

    0.03

    Method 2.2.4 C

    -0.06

    -0.04

    -0.05

    0.03

    0.01

     Tensile Strength ( PI )

    Method 2.4.19

    MPa

    200

    220

    220

    160

    160

     Tensile Modulus ( PI )

    Method 2.4.19

    GPa

    6.4

    5.6

    6.2

    5.2

    5.0

     Solder Float at 300 °C, 120 s

    Method 2.4.13

    -

    Pass

    Pass

    Pass

    Pass

    Pass

     Chemical Resistance

    Method 2.3.2

    %

    Pass, > 90%

    Pass, > 90%

    Pass, > 90%

    Pass, > 90%

    Pass, > 90%

     Dk ( at 10 GHz )

    Method 2.5.5.3

    -

    3.02

    3.42

    3.37

    3.02

    3.00

     Df ( at 10 GHz )

    Method 2.5.5.3

    -

    0.0042

    0.0025

    0.0022

    0.0019

    0.0019

     Dielectric Strength

    ASTM D-149

    V/μm

    > 120

    > 120

    > 120

    > 120

    > 120

     Volume Resistivity

    Method 2.5.17

    MΩ-cm

    > 1.1×108

    > 1.1×108

    > 1.1×108

    > 1.1×108

    > 1.1×108

     Surface Resistance

    Method 2.5.17

    > 1.1×107

    > 1.1×107

    > 1.1×107

    > 1.1×107

    > 1.1×107


    Performance





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